

产品概览
- 产品型号
- conga-B7AC/CSP-Cu-B
- 现有数量
- 0
- 制造商
- congatec
- 产品类别
- CPU与芯片冷却器
- 产品描述
- CPU与芯片冷却器 Standard passive cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP up to 17W * Cu = copper plate * B = Bore hole standoffs
文档与媒体
- 数据列表
- conga-B7AC/CSP-Cu-B
产品详情
- 系列 :
- conga-B7AC
- 高度 :
- 20 mm